大米淀粉与大豆粉比例对糊化特性及物性学性质的影响
作者:
作者单位:

(中国食品风味与营养健康创新中心 北京工商大学 北京 100048)

作者简介:

通讯作者:

中图分类号:

基金项目:


Effect of Intermixing Ratio of Rice Starch and Soybean Flour on Their Pasting Characteristics and Physical Properties
Author:
Affiliation:

(China Food Flavor and Nutrition Health Innovation Center, Beijing Technology and Business University,Beijing 100048)

Fund Project:

  • 摘要
  • |
  • 图/表
  • |
  • 访问统计
  • |
  • 参考文献
  • |
  • 相似文献
  • |
  • 引证文献
  • |
  • 资源附件
  • |
  • 文章评论
    摘要:

    将大米淀粉(RS)和大豆粉(S)按不同比例混合,对混合体系进行糊化特性、颗粒特性、流变及摩擦学特性分析。结果表明:S抑制淀粉的糊化,导致糊化温度升高。随着S浓度的增加,混合物的糊化温度由85.55 ℃提高到了94.5 ℃,峰值黏度由1 461 cp下降到25 cp,衰减值由741 cp下降到2 cp,回生值由1 028 cp下降到13 cp,并且RS和S混合糊化后粒径增大,抑制淀粉凝胶的形成。所有样品均表现出剪切稀释行为,加入大豆粉会产生较低的黏度、屈服应力和稠度系数。在滑动速度 < 10 mm/s时,除RS/SP 9/1外,RS和S的混合使摩擦系数有所增大。

    Abstract:

    Rice starch (RS) and soybean flour (S) were mixed in different proportions, and the mixed system was analyzed for pasting characteristics, particle characteristics, rheology and tribological properties. S inhibited starch pasting, leading to an increase in the pasting temperature. As the concentration of S increased, the pasting temperature of the mixtures increased from 85.55 ℃ to 94.5 ℃, the peak viscosity decreased from 1 461 cp to 25 cp, the decay value from 741 cp to 2 cp, and the regrowth value from 1 028 cp to 13 cp. And the particle size increased after RS and S mixed pasting, which inhibited the formation of starch gel. All samples exhibited shear dilution behavior, and the addition of soybean flour produced lower viscosity, yield stress, and consistency coefficient. At a sliding speed of < 10 mm/s, the combination of RS and S increased the friction coefficient, except for RS/S 9/1.

    参考文献
    相似文献
    引证文献
引用本文

庞志花,刘萍,曹金诺,刘新旗,陈存社.大米淀粉与大豆粉比例对糊化特性及物性学性质的影响[J].中国食品学报,2023,23(9):53-59

复制
分享
文章指标
  • 点击次数:
  • 下载次数:
  • HTML阅读次数:
  • 引用次数:
历史
  • 收稿日期:2022-09-22
  • 最后修改日期:
  • 录用日期:
  • 在线发布日期: 2023-11-22
  • 出版日期:
文章二维码
版权所有 :《中国食品学报》杂志社     京ICP备09084417号-4
地址 :北京市海淀区阜成路北三街8号9层      邮政编码 :100048
电话 :010-65223596 65265375      电子邮箱 :chinaspxb@vip.163.com
技术支持:北京勤云科技发展有限公司

漂浮通知


×
《中国食品学报》杂志社招聘编辑